1. scope this specification sha ll cover the characterist ics of saw filter with 448m used for the page system. 2. electrical specification dc voltage vdc 10v ac voltage vpp 10v50hz/60hz operation temperature -20 to +60 storage temperature -45 to +85 rf power dissipation 0dbm electronic characteristics 2-1.typical frequency response 2-2.electrical characteristics part number f448as4 unit nominal center frequency (fo) 448 mhz insertion loss 1.fo-45.8~fo-39.8 mhz 50min. db 2.fo 2 mhz 3.5max. 3.fo +39.8~ fo +45.8mhz 45min. ripple (with fo 2mhz) 2.0max db input/output impedance(nominal) 50//0 /pf http://www.luguang.cn mail:lge@luguang.cn HDF448A-S4
3.test circuit 4. dimension http://www.luguang.cn mail:lge@luguang.cn HDF448A-S4
5. environmental characteristics 5-1 temperature cycling subject the device to a low temperature of -40 for 30 minutes. following by a high temperature of +25 for 5 minutes and a hi gher temperature of +85 for 30 minutes. then release the device into the room conditions for 1 to 2 hours prio r to the measurement. it shall meet the specifications in table 1. 5-2 resistance to solder heat submerge the device terminals into the solder bath at 260 5 for 10 1 sec. then release the device into the room conditions for 4 hours. it shall meet the specifications in table 1. 5-3 solderability submerge the device terminals into the solder bath at 245 5 for 5s, more than 95% area of the soldering pad must be cove red with new solder. it shall meet the specifications in table 1. 5-4 mechanical shock drop the device randomly onto the c oncrete floor from the height of 1 m 3 times. the filter shall fulfill the specifications in table 1. 5-5 vibration subject the device to the vibration for 2 hour each in x,y and z axes with the amplitude of 1.5 mm at 10 to 55 hz. the filter shall fulfill the specifications in table 1. 6. remark 6.1 static voltage static voltage between signal load & ground may cause deterior ation &destruction of the component. please avoid static voltage. 6.2 ultrasonic cleaning ultrasonic vibration may cause deterioration & destructio n of the component. please avoid ultrasonic cleaning 6.3 soldering only leads of component may be solder ed. please avoid soldering another part of component. 7. packing 7.1 dimensions (1) carrier tape: figure 1 (2) reel: figure 2 (3) the product shall be packed properly not to be damaged during trans portation and storage. http://www.luguang.cn mail:lge@luguang.cn HDF448A-S4
7.2 reeling quantity 1000 pcs/reel 7?? 3000 pcs/reel 13?? 7.3 taping structure (1) the tape shall be wound around th e reel in the direction shown below. (2) label device name user product name quantity lot no. (3) leader part and vaca nt position specifications. 8. tape specifications 8.1 tensile strength of ca rrier tape: 4.4n/mm width http://www.luguang.cn mail:lge@luguang.cn HDF448A-S4
8.2 top cover tape adhesion (see the below figure) (1) pull off angle: 0~15 o (2) speed: 300mm/min. (3) force: 20~70g [figure 1] carrier tape dimensions [unit:mm] w f e p0 p1 p2 d0 d1 t1 t2 a b 12.00 0.30 5.50 0.10 1.75 0.10 4.00 0.10 8.00 0.10 2.00 0.10 ?1.50 ?1.0 0.25 0.25 0.05 1.65 0.10 4.04 0.10 4.10 0.10 [figure 2] http://www.luguang.cn mail:lge@luguang.cn HDF448A-S4
[unit:mm] a b c d e w t r ? 330 1.0 ? 100 0.5 ? 13 0.5 ? 21 0.8 2 0.5 13 0.3 3 max. 1.0 max. http://www.luguang.cn mail:lge@luguang.cn HDF448A-S4
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